Glossary entry (derived from question below)
German term or phrase:
Anlagerung
English translation:
electrolytic deposits
Added to glossary by
Kerstin Green
May 18, 2009 14:30
15 yrs ago
German term
Anlagerung
German to English
Tech/Engineering
Electronics / Elect Eng
PCB QC - Metallization
ausreichend für die darauf folgenden elektrolytischen **Anlagerungen**
Proposed translations
(English)
3 +2 | electrolytic deposits | Kerstin Green |
4 | (the process of ) electrolytical accumulation | Ellen Kraus |
3 | electrolytical depositions | Edith Kelly |
2 | electrolytic accretion | Bernd Runge |
Change log
May 19, 2009 16:09: Kerstin Green Created KOG entry
Proposed translations
+2
16 mins
Selected
electrolytic deposits
from the little context (PCBs) I think this is the right term
Reference:
Note from asker:
Thanks for your help. |
4 KudoZ points awarded for this answer.
Comment: "Thanks for your help."
9 mins
electrolytical depositions
e.g. British Library Direct: Electrolytical deposition of Ni Co films ... - Order from the British Library: Electrolytical deposition of Ni Co films on Fe micro-particles.
direct.bl.uk/research/18/2C/RN226559900.html
direct.bl.uk/research/18/2C/RN226559900.html
Note from asker:
Thanks for your help. |
18 mins
(the process of ) electrolytical accumulation
I would suggest
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Note added at 21 Min. (2009-05-18 14:51:53 GMT)
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By applying a non-electrolytic accumulation step, the maximum permissible concentrations of foreign elements in the determination of nitrite increased ...
www.jsac.or.jp/bunka/0212a.html
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Note added at 21 Min. (2009-05-18 14:51:53 GMT)
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By applying a non-electrolytic accumulation step, the maximum permissible concentrations of foreign elements in the determination of nitrite increased ...
www.jsac.or.jp/bunka/0212a.html
Note from asker:
Thanks for your help. |
1 hr
German term (edited):
elektrolytische Anlagerung
electrolytic accretion
Es ist schade, dass es nicht ersichtlich ist, was hier angelagert werden soll.
Bei der gewollten Anlagerung würde ich von accretion, accumulation oder entrainment sprechen, je nach Gebiet.
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Note added at 1 Stunde (2009-05-18 16:29:03 GMT)
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Okay, having PCB, electrolytic, copper and tin-lead, I would most probably favour
PLATING
because copper and tin/lead electro-plating seem to be very common in the field of PCBs.
Bei der gewollten Anlagerung würde ich von accretion, accumulation oder entrainment sprechen, je nach Gebiet.
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Note added at 1 Stunde (2009-05-18 16:29:03 GMT)
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Okay, having PCB, electrolytic, copper and tin-lead, I would most probably favour
PLATING
because copper and tin/lead electro-plating seem to be very common in the field of PCBs.
Note from asker:
copper and tin-lead |
Thanks for your help. |
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