Elinizdeki metine göre anlamı farklı olabilir ama Die bence baskı devre gözü/yuvası veya Matris gibi bir anlama geliyor. Fakat şirket ismi de olabilir
Türkçe anlamı bir şey bulunsa okuyan anlar mı ayrı mesele
Wafer :Wafer , Yonga Plakası

Semiconductors şirketinin bu ürün çizgisiyle ilgili alt şirketi var aşağıda ilgili linkler. LTD şirket geçiyor. aşrıca Wafer ile ilgili de var mı bilmem. Ama Bu da bir ihtimal.Şirket değilse yani ticari marka değilse Baskı devre denilebilir. Ayrıca sadece o şirketin değil tümünün böyle bir ürün çizgisi var internette diğer şiktelerinde bu ürünler var.

Türkçe bir referansta aynen die kullanılmış
Northwood 2.2GHz
... Surface (200 mm wafer) = 31417 mm 2 Surface (300 mm wafer) = 70688 mm
2. CPU die (Willamette) = 217 mm 2 CPU die (Northwood) = 146 mm 2. ...
www.hardwaremania.com/reviews/NW24/n2.shtml - 32k - Önbellek - Benzer sayfalar

National's Die Product Business Unit works with our Die Partners to provide a complete solution to die users.
These Die Partners can be contacted
die and wafer
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Die Technology Ltd
http://www.national.com/appinfo/die/die_partners.html
Die Technology Ltd is a volume supplier of wafer and die. With a large stock Ditech can turn fast deliveries in wafer or die form. We offer a wide range of shipping methods from waffle tray, gel pack, wafer sawn on foil to tape and reel. Ditech can service commercial sales through to full military release where their in house test and probe department ensure full customer compliance. Ditech's customized software enables quick and accurate response on

ES DPBU - Overview to Die & Wafer
... Return to Die Home Page. Overview of Die / Wafer Products at National. ... National
Semiconductor offers a broad range of products in both die and wafer form. ...
www.national.com/appinfo/die/0,1826,764,00.html - 19k - Önbellek - Benzer sayfalar
[ www.national.com alanından daha fazla sonuç göster ]



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Note added at 2003-03-09 09:23:25 (GMT)
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Die : belki çekirdek yuvası da olabilir. Core yani

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Note added at 2003-03-09 10:07:16 (GMT)
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Eğer ticari marka değilse
__________________________________________
Ben Matris (Die ) ve Yonga Plakası (Wafer ) ürünleri derdim
yani yanlarında açıklamalarla
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Die in Waffle Tray
The die are placed in the tray by use of either 2 methods, by hand or by use of a Pick & Place machine( See Pick & Place). For manual placement each die is manually peeled from the ring frame tape and placed in it\'s cavity by use of a vacuum pencil (Picture). The die are lifted by the their side in order to prevent damage to the active surface of the die, once positioned over their cavity the vacuum running through the pencil is released and the die are placed into their cavity. This task requires a great deal of skill and is measured by a strict training schedule before staff are allowed to work \'active\' die. The waffle trays themselves come in various sizes where once again the size of the cavity varies to accommodate the die that are placed in it. To prevent the trayed die from ESD damage an ESD protective Tyvek slip is placed over the tray top once loading is complete and the lid is placed on.
Die in Gel Pak
The die are placed by a similar method as the waffle pack. The gel uses a sticky surface tension in order to minimalise potential movement of the die in transport. Gel-Paks are orientated to more specialist handling where often the die size can very large and requires particular dexterity.
Wafer forms
Customers may wish to perform their own sawing in which case they can receive the wafer uncut or placed onto foil ringframes ready for sawing.

Turkcede tam karsiligi yok galiba (ben bulamadim).
Tayfun beyin aciklamalari dogru. Benim anladigim kadariyla yari iletken plaka =WAFER; bu plakanin uzerindeki zar gibi sekillere die deniliyor. Umarim yardimci olur.

Die
An individual rectangular pattern on a wafer that contains circuitry to perform a specific function. The internal circuitry is made of thousands of tiny electronic parts. 'Die' refers to a semiconductor component or part that has not yet been packaged (also known as 'IC' (Integrated Circuit) or 'chip').


Wafer

Very thin semiconductor disc made of silicon, from which many individual chips can be manufactured; the wafer is sliced, thereby defining the so-called dice.