It is the generic term used in this context
http://www.flipchips.com/tutorial01.html
Flip chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, the older technology which flip chip is replacing, uses face-up chips with a wire connection to each pad.

Flip chip components are predominantly semiconductor devices; however, components such as passive filters, detector arrays, and MEMs devices are also beginning to be used in flip chip form. Flip chip is also called Direct Chip Attach (DCA), a more descriptive term, since the chip is directly attached to the substrate, board, or carrier by the conductive bumps.

http://www.siliconfareast.com/cob.htm
Chip-on-Board, or COB, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically interconnected to its final circuit board, instead of undergoing traditional assembly or packaging as an individual IC. The elimination of conventional device packaging from COB assemblies simplifies the over-all process of designing and manufacturing the final product, as well as improves its performance as a result of the shorter interconnection paths.
The general term for COB technology is actually 'direct chip attachment', or DCA. Aside from circuit boards used for COB's, various substrates are available for use in DCA. There are, for instance, ceramic and glass ceramic substrates which exhibit excellent dielectric and thermal properties. Organic substrates that weigh and cost less while providing a low dielectric constant also exist. There are also flex substrates which, being pliable, have the ability to bend. DCA assemblies have received a number of other names aside from 'COB' based on these available substrates, e.g., chip-on-glass (COG), chip-on-flex (COF), etc.

The COB process consists of just three major steps: 1) die attach or die mount; 2) wirebonding; and 3) encapsulation of the die and wires. A variant of COB assembly, the flip-chip on board (FCOB), does not require wirebonding since it employs a chip whose bond pads are bumped, which are the ones that connect directly to designated pads on the board. As such, FCOB's have their chips facing downward on the board (hence the name 'flipchip'). Aside from encapsulation, it is also necessary to 'underfill' a flip chip to protect its active surface and bumps from thermo-mechanical and chemical damage.

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Note added at 16 hrs (2011-12-10 08:29:17 GMT)
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http://dspace.mit.edu/bitstream/handle/1721.1/50398/40606893...

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Note added at 16 hrs (2011-12-10 08:30:12 GMT)
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http://www3.uic.com/wcms/Images.nsf/0/f2f59d78597c84ea852569...$FILE/Borgesen.pdf

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Note added at 16 hrs (2011-12-10 08:30:31 GMT)
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http://www.semicorp.com/articles/flip-chip-attachment.html