English to French Tech/Engineering Patents NON-THERMOFUSIBLE GRANULAR PHENOL RESIN, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR

a non-thermofusibilizing step of forming a non-thermofusible phénol resin powder by heating the reaction liquid containing said phénol resin powder.

a method for producing a non-thermofusible phénol resin powder according to daim 1, including (1) a phénol resin powder forming step of forming a phénol resin powder by reacting an aldéhyde and a phenolic compound in an aqueous médium in the présence of an acidic catalyst having a molar concentration of at least 2.0 mol/L in a reaction liquid and a protective colloïdal agent, (2) a non-thermofusibilizing step of forming a non-thermofusible phénol resin powder by heating the reaction liquid containing the phénol resin powder, and (3) a separating-washing step of separating the non-thermofusible phénol resin powder from the reaction liquid and washing the same. This method is suitably applied as a method for producing the aforementioned non-thermofusible phénol resin powder according to the présent invention.